Hands-On with Delidded AMD Ryzen 9 7950X CPU
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Date: 2022-08-30
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Comments and reviews: 14
SergentBoucherie
When I built my computer I decided that I would upgrade my CPU to whatever model would be the last CPU would fit on my motherboard, about 2 months ago I upgraded to a 5950X, the guy never used it, it was still wrapped. I got it for 550 CAD. Hopefully I will be using for at least 5 years.
Now I am waiting to see the new GPUs and probably will change my 2080 super for whatever top of the line AMD releases soonishly.
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When I built my computer I decided that I would upgrade my CPU to whatever model would be the last CPU would fit on my motherboard, about 2 months ago I upgraded to a 5950X, the guy never used it, it was still wrapped. I got it for 550 CAD. Hopefully I will be using for at least 5 years.
Now I am waiting to see the new GPUs and probably will change my 2080 super for whatever top of the line AMD releases soonishly.
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Asmongold's
We know from the past that the infinity fabric will basically make dual chiplets seamless when communicating and depending on each other. However having everything on one chiplet will have its benefit and that's why I'm getting a 7700X unless they release a 7800X (which they already registered the name of). I am not a content creator and I do not need 12 or more cores. 8 cores are MORE than enough for gamers.
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We know from the past that the infinity fabric will basically make dual chiplets seamless when communicating and depending on each other. However having everything on one chiplet will have its benefit and that's why I'm getting a 7700X unless they release a 7800X (which they already registered the name of). I am not a content creator and I do not need 12 or more cores. 8 cores are MORE than enough for gamers.
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Alovon
On a 3900X ATM, and just got a 4K 120hz TV (meaning both my Monitors are high refresh now) and tried testing it and realized my 3900X can't really hit 120fps in some of my most important games when CPU bound XD (FFXIV looking at you).
So thinking of getting a CPU upgrade so I can actually get 120fps (I have a 2080Ti right now, and am guaranteed to get my dad's 3080)
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On a 3900X ATM, and just got a 4K 120hz TV (meaning both my Monitors are high refresh now) and tried testing it and realized my 3900X can't really hit 120fps in some of my most important games when CPU bound XD (FFXIV looking at you).
So thinking of getting a CPU upgrade so I can actually get 120fps (I have a 2080Ti right now, and am guaranteed to get my dad's 3080)
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Rama
This is a great release, but for many people it probably won't be worth upgrading their motherboard or other system components. The fundamental point of disinterest for me as a gamer is that GPU is still the bottleneck almost indefinitely since you can nearly always just turn up the graphics, especially with raytracing. Really hoping they step up their game with GPU's.
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This is a great release, but for many people it probably won't be worth upgrading their motherboard or other system components. The fundamental point of disinterest for me as a gamer is that GPU is still the bottleneck almost indefinitely since you can nearly always just turn up the graphics, especially with raytracing. Really hoping they step up their game with GPU's.
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Mauricio
Hate LGA. Bought 4 Intel motherboards ever, 2 came with pin problems in the socket. Unfixable. Bought 4 AMD motherboards in my life. Never a single socket problema. Once dropped the processor and some pins bent. Bent them back straight with no issue. The processor worked flawlessly until the day I sold it. Worked flawlessly after by the buyers' opinion.
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Hate LGA. Bought 4 Intel motherboards ever, 2 came with pin problems in the socket. Unfixable. Bought 4 AMD motherboards in my life. Never a single socket problema. Once dropped the processor and some pins bent. Bent them back straight with no issue. The processor worked flawlessly until the day I sold it. Worked flawlessly after by the buyers' opinion.
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will7
Design of this IHS is just awfull. I already see that termal paste going between IHS and PCB. Also good luck for people who will benchmark those CPUs witch new coolers/AiOs - cleaning it will be nightmare. Only hope that, beside IHS spider legs , they will decide to put some silicone on whole circiut of IHS.
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Design of this IHS is just awfull. I already see that termal paste going between IHS and PCB. Also good luck for people who will benchmark those CPUs witch new coolers/AiOs - cleaning it will be nightmare. Only hope that, beside IHS spider legs , they will decide to put some silicone on whole circiut of IHS.
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Dread
Should we be concerned about the exposed parts of the cpu collecting dust? Typically everything of import is below the plate, so it has never really been an issue in the past.
(dust is always an issue - but you get what i mean - we haven't had parts of the cpu exposed before like this below the cooler).
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Should we be concerned about the exposed parts of the cpu collecting dust? Typically everything of import is below the plate, so it has never really been an issue in the past.
(dust is always an issue - but you get what i mean - we haven't had parts of the cpu exposed before like this below the cooler).
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Jonathon
Not sure how the old spreaders were built, but does the nickpe plating mean you would not want to lap it? or lapping takes so little off it is irrelevant?
Re: silicone if holding the spreader up off the die
Would they not have engineering the spreader with the silicon glue in mind?
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Not sure how the old spreaders were built, but does the nickpe plating mean you would not want to lap it? or lapping takes so little off it is irrelevant?
Re: silicone if holding the spreader up off the die
Would they not have engineering the spreader with the silicon glue in mind?
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nightwolf667z
I wonder what challenges the open areas around the SMDs will create for XOC. Also if there may be some small extra benefit to down draft air flow around the processor did to these gaps.
As tight as it already is, it has me worried for multiple generation support though.
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I wonder what challenges the open areas around the SMDs will create for XOC. Also if there may be some small extra benefit to down draft air flow around the processor did to these gaps.
As tight as it already is, it has me worried for multiple generation support though.
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taith2
It's what I've been waiting for! Planning to use LM in the future and all those exposed SMD elements seem thirsty for it
Also can see overclocking gimmick potential that might prove popular, pumping thermal paste under IHS for better overall conductivity, wouldn't hurt I think
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It's what I've been waiting for! Planning to use LM in the future and all those exposed SMD elements seem thirsty for it
Also can see overclocking gimmick potential that might prove popular, pumping thermal paste under IHS for better overall conductivity, wouldn't hurt I think
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Hal
Dude, you dont actually bite your nails. Congrats on that. This is quite the interesting Show considering AMD just had their announcements yesterday. You always provide the straight stuff when analyzing anything. Thanks once again for an excellent presentation. Carry on.
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Dude, you dont actually bite your nails. Congrats on that. This is quite the interesting Show considering AMD just had their announcements yesterday. You always provide the straight stuff when analyzing anything. Thanks once again for an excellent presentation. Carry on.
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Alistair
I'm gonna wait until 8000 since I really like my 5700x right now. But I'm definitely going to try and not worry about thermal paste between the feet. Paste in those spaces probably won't matter at all and you won't even see it with a cooler attached.
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I'm gonna wait until 8000 since I really like my 5700x right now. But I'm definitely going to try and not worry about thermal paste between the feet. Paste in those spaces probably won't matter at all and you won't even see it with a cooler attached.
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RAZORLIGHT
Don't like the design of the IHS, will be hell to clean from thermal paste once you put too much on the heatspreader :/
A shame they didn't rearrange the chiplet placement for better heat dissipation, still need cooler with offset mounting.
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Don't like the design of the IHS, will be hell to clean from thermal paste once you put too much on the heatspreader :/
A shame they didn't rearrange the chiplet placement for better heat dissipation, still need cooler with offset mounting.
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Leoronus
I assume with these exposed SMDs and seemingly a gap between the IHS and substrate, using a non-conductive thermal compound would now be mandatory, right?
(I know, pretty much every solution on the market should already be non-conductive)
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I assume with these exposed SMDs and seemingly a gap between the IHS and substrate, using a non-conductive thermal compound would now be mandatory, right?
(I know, pretty much every solution on the market should already be non-conductive)
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